Effects of Temperature on the Fracture Response of EMC-Si Interface Found in Multilayer Semiconductor Components

Effects of Temperature on the Fracture Response of EMC-Si Interface Found in Multilayer Semiconductor Components

Despite the fact that temperature is an important condition that affects the behavior of material interfaces used in integrated circuits (ICs), such as the case for epoxy molding compound (EMC) and silicon (Si), this has not been thoroughly studied. To fill this gap, the present work aims to examine...

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Main Authors: João Valdoleiros, Alireza Akhavan-Safar, Payam Maleki, Pedro F. C. Videira, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy, Lucas F. M. da Silva
Format: Article
Language:English
Published: MDPI AG 2025-01-01
Series:Surfaces
Subjects:
semiconductor
cohesive zone modeling
bi-material interface
quasi-static test
silicon
Online Access:https://www.mdpi.com/2571-9637/8/1/2
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