Exploring Chemical Catalytic Mechanisms for Enhancing Bonding Energy in Direct Silicon Dioxide Wafer Bonding
The influence of pH on silicon dioxide direct bonding is studied, unveiling its role in bonding energy enhancement. We show that the deposition of basic salt or molecules consistently increases the silicon dioxide adherence energy. The underlying mechanisms, including silica hydrolysis and catalysis...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/15/7/3883 |
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