Risk of transition to lead-free in the space sector: Sn whisker growth in thermal vacuum conditions from submicron Sn layer
Sn whisker growth was investigated from submicron Sn layers on Cu substrates in thermal vacuum conditions to compare the growth differences in ambient and space conditions. Cu substrates were covered with 500 nm thick Sn by PVD. The samples were kept at 50 °C and 8.3x10-6 mbar for 1000 h in order to...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-02-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525000577 |
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