Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method
Abstract In this paper, the material removal mechanism of copper chemical mechanical polishing was studied by the quasicontinuum method that integrated molecular dynamics and the finite element method. By analyzing the abrasive process of different particle sizes on single crystal copper, we investi...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Tsinghua University Press
2017-03-01
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| Series: | Friction |
| Subjects: | |
| Online Access: | http://link.springer.com/article/10.1007/s40544-017-0142-1 |
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