Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism
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Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
Wiley
1983-01-01
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Series: | Active and Passive Electronic Components |
Online Access: | http://dx.doi.org/10.1155/APEC.10.111 |
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_version_ | 1832558145264680960 |
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author | Jacques D. Agniel Christian M. Val |
author_facet | Jacques D. Agniel Christian M. Val |
author_sort | Jacques D. Agniel |
collection | DOAJ |
format | Article |
id | doaj-art-f442c84e0f4948baa58c48bc98542b83 |
institution | Kabale University |
issn | 0882-7516 1563-5031 |
language | English |
publishDate | 1983-01-01 |
publisher | Wiley |
record_format | Article |
series | Active and Passive Electronic Components |
spelling | doaj-art-f442c84e0f4948baa58c48bc98542b832025-02-03T01:33:14ZengWileyActive and Passive Electronic Components0882-75161563-50311983-01-01102-311112710.1155/APEC.10.111Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing MechanismJacques D. AgnielChristian M. Valhttp://dx.doi.org/10.1155/APEC.10.111 |
spellingShingle | Jacques D. Agniel Christian M. Val Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism Active and Passive Electronic Components |
title | Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism |
title_full | Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism |
title_fullStr | Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism |
title_full_unstemmed | Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism |
title_short | Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism |
title_sort | mounting of micropackages in vapour phase soldering and study of ageing mechanism |
url | http://dx.doi.org/10.1155/APEC.10.111 |
work_keys_str_mv | AT jacquesdagniel mountingofmicropackagesinvapourphasesolderingandstudyofageingmechanism AT christianmval mountingofmicropackagesinvapourphasesolderingandstudyofageingmechanism |