Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism

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Bibliographic Details
Main Authors: Jacques D. Agniel, Christian M. Val
Format: Article
Language:English
Published: Wiley 1983-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/APEC.10.111
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author Jacques D. Agniel
Christian M. Val
author_facet Jacques D. Agniel
Christian M. Val
author_sort Jacques D. Agniel
collection DOAJ
format Article
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institution Kabale University
issn 0882-7516
1563-5031
language English
publishDate 1983-01-01
publisher Wiley
record_format Article
series Active and Passive Electronic Components
spelling doaj-art-f442c84e0f4948baa58c48bc98542b832025-02-03T01:33:14ZengWileyActive and Passive Electronic Components0882-75161563-50311983-01-01102-311112710.1155/APEC.10.111Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing MechanismJacques D. AgnielChristian M. Valhttp://dx.doi.org/10.1155/APEC.10.111
spellingShingle Jacques D. Agniel
Christian M. Val
Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism
Active and Passive Electronic Components
title Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism
title_full Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism
title_fullStr Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism
title_full_unstemmed Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism
title_short Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism
title_sort mounting of micropackages in vapour phase soldering and study of ageing mechanism
url http://dx.doi.org/10.1155/APEC.10.111
work_keys_str_mv AT jacquesdagniel mountingofmicropackagesinvapourphasesolderingandstudyofageingmechanism
AT christianmval mountingofmicropackagesinvapourphasesolderingandstudyofageingmechanism