A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package

A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package

In this study, we identify the origin of electronic flame-off (EFO) errors based on the type of rinse applied for the surface treatment of gold (Au) wires in the wire-bonding semiconductor packaging process. Hydrocarbon and silicone surfactants are commonly used for Au wire surface treatment, and fi...

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Bibliographic Details
Main Authors: Jisu Lim, Wonbin Kim, Suk Jekal, Jiwon Kim, Ha-Yeong Kim, Zambaga Otgonbayar, Jeoung Han Kim, Jinsung Rho, Woo-Jin Song, Chang-Min Yoon
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Access
Subjects:
Au wire
electronic flame-off
rinse composition
surface treatment
wire-bonding semiconductor packaging
Si-containing dust
Online Access:https://ieeexplore.ieee.org/document/10928992/
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