Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

Workpiece rotational grinding is widely used in the ultra-precision machining of hard and brittle semiconductor materials, including single-crystal silicon, silicon carbide, and gallium arsenide. Surface roughness and subsurface damage depth (SDD) are crucial indicators for evaluating the surface qu...

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Bibliographic Details
Main Authors: Shang Gao, Haoxiang Wang, Han Huang, Zhigang Dong, Renke Kang
Format: Article
Language:English
Published: IOP Publishing 2025-01-01
Series:International Journal of Extreme Manufacturing
Subjects:
surface quality
grinding
predictive models
semiconductor materials
surface roughness
subsurface damage depth
Online Access:https://doi.org/10.1088/2631-7990/adae67
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https://doi.org/10.1088/2631-7990/adae67

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