Via placement optimization for a group of wires

Most PCB design CAD systems offer a limited number of “patterns” for the via placement on a bus (group of wires) which would be either a single- or a double-row placement. This article demonstrates the incorrectness of such limitations, because in this case the mounting space is used not in an optim...

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Main Authors: K. A. Knop, S. Yu. Luzin
Format: Article
Language:English
Published: Politehperiodika 2015-06-01
Series:Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
Subjects:
Online Access:https://tkea.com.ua/index.php/journal/article/view/278
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_version_ 1849312697025298432
author K. A. Knop
S. Yu. Luzin
author_facet K. A. Knop
S. Yu. Luzin
author_sort K. A. Knop
collection DOAJ
description Most PCB design CAD systems offer a limited number of “patterns” for the via placement on a bus (group of wires) which would be either a single- or a double-row placement. This article demonstrates the incorrectness of such limitations, because in this case the mounting space is used not in an optimal way. The paper presents the optimum solution for a certain type of problems on via placement when changing the layer of a bus. The solution suggests a regular (periodic) arrangement, but with a multi-row placement. The calculation of the parameters for optimal placement is narrowed, in general, to finding the number of via rows with which the area of a topological fragment is minimal.
format Article
id doaj-art-e9637a2c00ce4ad1828fc169ec8b5d5a
institution Kabale University
issn 2225-5818
2309-9992
language English
publishDate 2015-06-01
publisher Politehperiodika
record_format Article
series Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
spelling doaj-art-e9637a2c00ce4ad1828fc169ec8b5d5a2025-08-20T03:53:01ZengPolitehperiodikaTekhnologiya i Konstruirovanie v Elektronnoi Apparature2225-58182309-99922015-06-012–3101410.15222/TKEA2015.2-3.10278Via placement optimization for a group of wiresK. A. Knop0S. Yu. Luzin1«Eremex» Ltd, Saint Petersburg, Russia«Eremex» Ltd, Saint Petersburg, RussiaMost PCB design CAD systems offer a limited number of “patterns” for the via placement on a bus (group of wires) which would be either a single- or a double-row placement. This article demonstrates the incorrectness of such limitations, because in this case the mounting space is used not in an optimal way. The paper presents the optimum solution for a certain type of problems on via placement when changing the layer of a bus. The solution suggests a regular (periodic) arrangement, but with a multi-row placement. The calculation of the parameters for optimal placement is narrowed, in general, to finding the number of via rows with which the area of a topological fragment is minimal.https://tkea.com.ua/index.php/journal/article/view/278printed wiringviagroup of wires
spellingShingle K. A. Knop
S. Yu. Luzin
Via placement optimization for a group of wires
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
printed wiring
via
group of wires
title Via placement optimization for a group of wires
title_full Via placement optimization for a group of wires
title_fullStr Via placement optimization for a group of wires
title_full_unstemmed Via placement optimization for a group of wires
title_short Via placement optimization for a group of wires
title_sort via placement optimization for a group of wires
topic printed wiring
via
group of wires
url https://tkea.com.ua/index.php/journal/article/view/278
work_keys_str_mv AT kaknop viaplacementoptimizationforagroupofwires
AT syuluzin viaplacementoptimizationforagroupofwires