Improving the Thermal Performance of Liquid Metal Thermal Interface Materials: The Role of Intermetallic Compounds at the Gallium/Copper Interface

Improving the Thermal Performance of Liquid Metal Thermal Interface Materials: The Role of Intermetallic Compounds at the Gallium/Copper Interface

Abstract Room‐temperature liquid metal has been widely used in electronic packaging due to its high thermal conductivity, but its thermal performance is strongly impeded by the dominated thermal boundary resistance between liquid metal and solid material. Here, first an order‐of‐magnitude reduction...

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Bibliographic Details
Main Authors: Xudong Zhang, Yuxia Dong, Yanzheng Du, Lei Yang, Weigang Ma, Bingyang Cao
Format: Article
Language:English
Published: Wiley-VCH 2025-06-01
Series:Advanced Materials Interfaces
Subjects:
bonding strength
electron transport
liquid metal
thermal conductance
thermal interface material
Online Access:https://doi.org/10.1002/admi.202500041
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https://doi.org/10.1002/admi.202500041

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