Low-Temperature Deuterium Annealing for HfO₂/SiO₂ Gate Dielectric in Silicon MOSFETs

In this study, low-temperature deuterium annealing (LTDA) at 300 °C is proposed to enhance both the performance and reliability of silicon-based high-k metal gate (HKMG) MOSFETs. A comparative study with hydrogen (H2) annealing under identical conditions is conducted to evaluate the speci...

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Main Authors: Tae-Hyun Kil, Ju-Won Yeon, Hyo-Jun Park, Moon-Kwon Lee, Eui-Cheol Yun, Min-Woo Kim, Sang-Min Kang, Jun-Young Park
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10758816/
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author Tae-Hyun Kil
Ju-Won Yeon
Hyo-Jun Park
Moon-Kwon Lee
Eui-Cheol Yun
Min-Woo Kim
Sang-Min Kang
Jun-Young Park
author_facet Tae-Hyun Kil
Ju-Won Yeon
Hyo-Jun Park
Moon-Kwon Lee
Eui-Cheol Yun
Min-Woo Kim
Sang-Min Kang
Jun-Young Park
author_sort Tae-Hyun Kil
collection DOAJ
description In this study, low-temperature deuterium annealing (LTDA) at 300 °C is proposed to enhance both the performance and reliability of silicon-based high-k metal gate (HKMG) MOSFETs. A comparative study with hydrogen (H2) annealing under identical conditions is conducted to evaluate the specific impact of deuterium (D2). Comprehensive DC characterizations and evaluations of stress immunity under hot-carrier injection (HCI) and positive bias stress (PBS) conditions, are performed. The results confirm that even at a low temperature of 300 °C, D2 has a more substantial effect on device performance and reliability compared to H2. This study provides a guideline for reducing the annealing temperature in the fabrication of HKMG MOSFETs.
format Article
id doaj-art-e5445f0aec104a1a8d3c76b41220648b
institution Kabale University
issn 2168-6734
language English
publishDate 2024-01-01
publisher IEEE
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series IEEE Journal of the Electron Devices Society
spelling doaj-art-e5445f0aec104a1a8d3c76b41220648b2025-01-28T00:00:42ZengIEEEIEEE Journal of the Electron Devices Society2168-67342024-01-01121030103310.1109/JEDS.2024.350273810758816Low-Temperature Deuterium Annealing for HfO₂/SiO₂ Gate Dielectric in Silicon MOSFETsTae-Hyun Kil0Ju-Won Yeon1Hyo-Jun Park2Moon-Kwon Lee3Eui-Cheol Yun4Min-Woo Kim5Sang-Min Kang6Jun-Young Park7https://orcid.org/0000-0003-4830-9739School of Semiconductor Engineering, Chungbuk National University, Cheongju, Republic of KoreaSchool of Semiconductor Engineering, Chungbuk National University, Cheongju, Republic of KoreaSchool of Semiconductor Engineering, Chungbuk National University, Cheongju, Republic of KoreaSchool of Semiconductor Engineering, Chungbuk National University, Cheongju, Republic of KoreaSchool of Semiconductor Engineering, Chungbuk National University, Cheongju, Republic of KoreaSchool of Semiconductor Engineering, Chungbuk National University, Cheongju, Republic of KoreaSchool of Semiconductor Engineering, Chungbuk National University, Cheongju, Republic of KoreaSchool of Semiconductor Engineering, Chungbuk National University, Cheongju, Republic of KoreaIn this study, low-temperature deuterium annealing (LTDA) at 300 °C is proposed to enhance both the performance and reliability of silicon-based high-k metal gate (HKMG) MOSFETs. A comparative study with hydrogen (H2) annealing under identical conditions is conducted to evaluate the specific impact of deuterium (D2). Comprehensive DC characterizations and evaluations of stress immunity under hot-carrier injection (HCI) and positive bias stress (PBS) conditions, are performed. The results confirm that even at a low temperature of 300 °C, D2 has a more substantial effect on device performance and reliability compared to H2. This study provides a guideline for reducing the annealing temperature in the fabrication of HKMG MOSFETs.https://ieeexplore.ieee.org/document/10758816/Annealinghigh-k dielectrichot-carrier injection (HCI)low-temperature deuterium annealing (LTDA)MOSFETspositive bias stress (PBS)
spellingShingle Tae-Hyun Kil
Ju-Won Yeon
Hyo-Jun Park
Moon-Kwon Lee
Eui-Cheol Yun
Min-Woo Kim
Sang-Min Kang
Jun-Young Park
Low-Temperature Deuterium Annealing for HfO₂/SiO₂ Gate Dielectric in Silicon MOSFETs
IEEE Journal of the Electron Devices Society
Annealing
high-k dielectric
hot-carrier injection (HCI)
low-temperature deuterium annealing (LTDA)
MOSFETs
positive bias stress (PBS)
title Low-Temperature Deuterium Annealing for HfO₂/SiO₂ Gate Dielectric in Silicon MOSFETs
title_full Low-Temperature Deuterium Annealing for HfO₂/SiO₂ Gate Dielectric in Silicon MOSFETs
title_fullStr Low-Temperature Deuterium Annealing for HfO₂/SiO₂ Gate Dielectric in Silicon MOSFETs
title_full_unstemmed Low-Temperature Deuterium Annealing for HfO₂/SiO₂ Gate Dielectric in Silicon MOSFETs
title_short Low-Temperature Deuterium Annealing for HfO₂/SiO₂ Gate Dielectric in Silicon MOSFETs
title_sort low temperature deuterium annealing for hfo x2082 sio x2082 gate dielectric in silicon mosfets
topic Annealing
high-k dielectric
hot-carrier injection (HCI)
low-temperature deuterium annealing (LTDA)
MOSFETs
positive bias stress (PBS)
url https://ieeexplore.ieee.org/document/10758816/
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