Loss Compensation in Microring-Based Si Photonics Devices via Er3+ Doped Claddings
We propose and demonstrate a method to compensate insertion losses in Si photonics devices based on ring resonators fabricated in SOI foundries, with no additional chip area used. It consists in the employment of Er:Al<inline-formula> <tex-math notation="LaTeX">$_2$</tex-mat...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2018-01-01
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| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8377995/ |
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