Loss Compensation in Microring-Based Si Photonics Devices via Er3+ Doped Claddings

We propose and demonstrate a method to compensate insertion losses in Si photonics devices based on ring resonators fabricated in SOI foundries, with no additional chip area used. It consists in the employment of Er:Al<inline-formula> <tex-math notation="LaTeX">$_2$</tex-mat...

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Bibliographic Details
Main Authors: Paulo Felipe Jarschel, Mario C. M. M. Souza, Rafael Borges Merlo, Newton C. Frateschi
Format: Article
Language:English
Published: IEEE 2018-01-01
Series:IEEE Photonics Journal
Subjects:
Online Access:https://ieeexplore.ieee.org/document/8377995/
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