A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages
This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to fu...
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| Format: | Article |
| Language: | English |
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Wiley
2016-01-01
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| Series: | International Journal of Antennas and Propagation |
| Online Access: | http://dx.doi.org/10.1155/2016/9562854 |
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| _version_ | 1832565133201637376 |
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| author | M. X. Yu |
| author_facet | M. X. Yu |
| author_sort | M. X. Yu |
| collection | DOAJ |
| description | This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to further improve the impedance matching level and thus attain better signal transition performance. A physics-based equivalent circuit modeling approach has been employed for this research. The right angle MS-to-MS via transition was also designed using this technique. The simulated S-parameters indicate that the match-pad design made a breakthrough in achieving an approximate −15 dB wide-band return loss reduction. The measured S-parameter of MS-to-MS transition showed that return loss with the matching pads is better than that without the matching pads. |
| format | Article |
| id | doaj-art-de66abacf7e04007b5c6bf8d1eda1b8a |
| institution | Kabale University |
| issn | 1687-5869 1687-5877 |
| language | English |
| publishDate | 2016-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Antennas and Propagation |
| spelling | doaj-art-de66abacf7e04007b5c6bf8d1eda1b8a2025-02-03T01:09:29ZengWileyInternational Journal of Antennas and Propagation1687-58691687-58772016-01-01201610.1155/2016/95628549562854A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer PackagesM. X. Yu0School of Physical Electronics, University of Electronic Science and Technology of China, No. 4, Section 2, North Jianshe Road, Chengdu 610054, ChinaThis paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to further improve the impedance matching level and thus attain better signal transition performance. A physics-based equivalent circuit modeling approach has been employed for this research. The right angle MS-to-MS via transition was also designed using this technique. The simulated S-parameters indicate that the match-pad design made a breakthrough in achieving an approximate −15 dB wide-band return loss reduction. The measured S-parameter of MS-to-MS transition showed that return loss with the matching pads is better than that without the matching pads.http://dx.doi.org/10.1155/2016/9562854 |
| spellingShingle | M. X. Yu A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages International Journal of Antennas and Propagation |
| title | A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages |
| title_full | A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages |
| title_fullStr | A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages |
| title_full_unstemmed | A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages |
| title_short | A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages |
| title_sort | novel microstrip to microstrip vertical via transition in x band multilayer packages |
| url | http://dx.doi.org/10.1155/2016/9562854 |
| work_keys_str_mv | AT mxyu anovelmicrostriptomicrostripverticalviatransitioninxbandmultilayerpackages AT mxyu novelmicrostriptomicrostripverticalviatransitioninxbandmultilayerpackages |