C2H4 reductive plasma treatment on copper surface for copper bonding
This study investigated the effects of C _2 H _4 plasma treatment on a Cu surface and its influence on the quality of Cu–to–Cu bonding. C _2 H _4 plasma is applied to enhance Cu bonding by producing reactive hydrogen for effective oxide removal and activation, while forming a protective carbon layer...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2025-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/addc3c |
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