Research on Silver Sintering Process and Wire Bonding Process of IGBT Module
The silver sintering process and copper wire bonding process used in IGBT module packaging were studied. Based on a series of quality characterization and evaluation methods, the process parameters of silver sintering and copper wire bonding were verified, optimized and analyzed. The influence of th...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2021-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.019 |
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| Summary: | The silver sintering process and copper wire bonding process used in IGBT module packaging were studied. Based on a series of quality characterization and evaluation methods, the process parameters of silver sintering and copper wire bonding were verified, optimized and analyzed. The influence of the surface finish coating on the strength of the sintered layer and the bonding interface of the copper wire was analyzed. Finally, the surge capacity and power cycle life of the trial-produced modules were tested. The results showed that the surge capacity and power cycle life of the modules with silver sintering and copper wire bonding technology were greatly improved compared with the ordinary modules, and the interface of silver sintering and copper wire bonding did not degrade obviously. |
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| ISSN: | 1000-128X |