Research on Silver Sintering Process and Wire Bonding Process of IGBT Module
The silver sintering process and copper wire bonding process used in IGBT module packaging were studied. Based on a series of quality characterization and evaluation methods, the process parameters of silver sintering and copper wire bonding were verified, optimized and analyzed. The influence of th...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2021-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.019 |
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