Study on influence of solder voids on power cycling lifetime of IGBT module
Studying the influencing factors of solder lifetime is of great significance to improve the reliability of IGBT modules, but the influence of solder voids as a solder layer defect on the power cycling lifetime of IGBT modules is still unknown. Considering that the process voids generated in the IGBT...
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| Main Authors: | LIU Peng, DENG Erping, ZHOU Wangjun, CHEN Jie, HUANG Yongzhang |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2023-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.014 |
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