Study on influence of solder voids on power cycling lifetime of IGBT module

Study on influence of solder voids on power cycling lifetime of IGBT module

Studying the influencing factors of solder lifetime is of great significance to improve the reliability of IGBT modules, but the influence of solder voids as a solder layer defect on the power cycling lifetime of IGBT modules is still unknown. Considering that the process voids generated in the IGBT...

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Bibliographic Details
Main Authors: LIU Peng, DENG Erping, ZHOU Wangjun, CHEN Jie, HUANG Yongzhang
Format: Article
Language:zho
Published: Editorial Department of Electric Drive for Locomotives 2023-09-01
Series:机车电传动
Subjects:
power cycling lifetime
solder void
void ratio
finite element simulation
random size
random position
Online Access:http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.014
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