Study on influence of solder voids on power cycling lifetime of IGBT module
Studying the influencing factors of solder lifetime is of great significance to improve the reliability of IGBT modules, but the influence of solder voids as a solder layer defect on the power cycling lifetime of IGBT modules is still unknown. Considering that the process voids generated in the IGBT...
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| Format: | Article |
| Language: | zho |
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Editorial Department of Electric Drive for Locomotives
2023-09-01
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| Series: | 机车电传动 |
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| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.014 |
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| author | LIU Peng DENG Erping ZHOU Wangjun CHEN Jie HUANG Yongzhang |
| author_facet | LIU Peng DENG Erping ZHOU Wangjun CHEN Jie HUANG Yongzhang |
| author_sort | LIU Peng |
| collection | DOAJ |
| description | Studying the influencing factors of solder lifetime is of great significance to improve the reliability of IGBT modules, but the influence of solder voids as a solder layer defect on the power cycling lifetime of IGBT modules is still unknown. Considering that the process voids generated in the IGBT module manufacturing process have random size and random unknown characteristics, power cycling tests were conducted under the same test conditions for double-sided cooled IGBT modules with different void ratios. The test results show that the higher the void ratio, the shorter the power cycling lifetime of the device under test. In order to reveal its influence mechanism, a three-dimensional finite element model of IGBT modules with different void ratios was established, and the voids built have random size and random position characteristics consistent with the actual process voids. Through finite element simulation, it is found that the higher the void ratio, the greater the maximum temperature of the solder layer and the chip, and the greater the viscoplastic strain caused, so the power cycling life is shorter. According to the power cycling test and fatigue simulation results, the recommended limit value for the void ratio of the IGBT module solder layer is 3%. The research results can provide guidance for the screening steps of solder voids of IGBT modules. |
| format | Article |
| id | doaj-art-d9db04fdb9b64126b6aa11e0923bcf98 |
| institution | OA Journals |
| issn | 1000-128X |
| language | zho |
| publishDate | 2023-09-01 |
| publisher | Editorial Department of Electric Drive for Locomotives |
| record_format | Article |
| series | 机车电传动 |
| spelling | doaj-art-d9db04fdb9b64126b6aa11e0923bcf982025-08-20T01:51:10ZzhoEditorial Department of Electric Drive for Locomotives机车电传动1000-128X2023-09-0113013842839128Study on influence of solder voids on power cycling lifetime of IGBT moduleLIU PengDENG ErpingZHOU WangjunCHEN JieHUANG YongzhangStudying the influencing factors of solder lifetime is of great significance to improve the reliability of IGBT modules, but the influence of solder voids as a solder layer defect on the power cycling lifetime of IGBT modules is still unknown. Considering that the process voids generated in the IGBT module manufacturing process have random size and random unknown characteristics, power cycling tests were conducted under the same test conditions for double-sided cooled IGBT modules with different void ratios. The test results show that the higher the void ratio, the shorter the power cycling lifetime of the device under test. In order to reveal its influence mechanism, a three-dimensional finite element model of IGBT modules with different void ratios was established, and the voids built have random size and random position characteristics consistent with the actual process voids. Through finite element simulation, it is found that the higher the void ratio, the greater the maximum temperature of the solder layer and the chip, and the greater the viscoplastic strain caused, so the power cycling life is shorter. According to the power cycling test and fatigue simulation results, the recommended limit value for the void ratio of the IGBT module solder layer is 3%. The research results can provide guidance for the screening steps of solder voids of IGBT modules.http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.014power cycling lifetimesolder voidvoid ratiofinite element simulationrandom sizerandom position |
| spellingShingle | LIU Peng DENG Erping ZHOU Wangjun CHEN Jie HUANG Yongzhang Study on influence of solder voids on power cycling lifetime of IGBT module 机车电传动 power cycling lifetime solder void void ratio finite element simulation random size random position |
| title | Study on influence of solder voids on power cycling lifetime of IGBT module |
| title_full | Study on influence of solder voids on power cycling lifetime of IGBT module |
| title_fullStr | Study on influence of solder voids on power cycling lifetime of IGBT module |
| title_full_unstemmed | Study on influence of solder voids on power cycling lifetime of IGBT module |
| title_short | Study on influence of solder voids on power cycling lifetime of IGBT module |
| title_sort | study on influence of solder voids on power cycling lifetime of igbt module |
| topic | power cycling lifetime solder void void ratio finite element simulation random size random position |
| url | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.014 |
| work_keys_str_mv | AT liupeng studyoninfluenceofsoldervoidsonpowercyclinglifetimeofigbtmodule AT dengerping studyoninfluenceofsoldervoidsonpowercyclinglifetimeofigbtmodule AT zhouwangjun studyoninfluenceofsoldervoidsonpowercyclinglifetimeofigbtmodule AT chenjie studyoninfluenceofsoldervoidsonpowercyclinglifetimeofigbtmodule AT huangyongzhang studyoninfluenceofsoldervoidsonpowercyclinglifetimeofigbtmodule |