KINEMATICS MODELING OF MAGNETIC AND ABRASIVE SILICON WAFER POLISHING
The paper considers possibilities to apply magnetic-abrasive machining method as one of the final operations for polishing flat surfaces of silicon wafers. A mathematical model has been built that reflects main principles of tool-work-piece interactions. A methodology has been developed th...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Belarusian National Technical University
2009-02-01
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| Series: | Наука и техника |
| Online Access: | https://sat.bntu.by/jour/article/view/617 |
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