Chemical mechanical polishing as an alternative surface treatment technique for corrosion prevention of carbon steel in an acidic medium

Abstract Chemical mechanical polishing (CMP) has been a standard technique in semiconductor manufacturing for achieving smooth surfaces. CMP utilizes a synergistic interplay of chemical and mechanical interactions to achieve the desired removal rates, selectivity, and ultimately planarity with diffe...

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Bibliographic Details
Main Authors: Mohamed Ahmed, Buthainah Ali Al-Timimi, Maha Al-Ali, Ghassan H. Abdullah, Safa Khalaf Atiyaha, Ahmed Yaseen Ali Aljanabi, Maizirwan Mel
Format: Article
Language:English
Published: Nature Portfolio 2025-04-01
Series:Scientific Reports
Subjects:
Online Access:https://doi.org/10.1038/s41598-025-98210-w
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