Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling
Abstract Thermal and power integrity management remains a fundamental challenge in 2.5-dimensional (2.5D) integrated microsystem design. This paper proposes an electrothermal co-optimization design methodology for a 2.5D power distribution network with thermal through silicon via (TTSV) cooling. A h...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2025-07-01
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| Series: | Scientific Reports |
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| Online Access: | https://doi.org/10.1038/s41598-025-09914-y |
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| author | Yang Wang Changle Zhi Gang Dong Daihang Liu Deguang Yang Zhangming Zhu |
| author_facet | Yang Wang Changle Zhi Gang Dong Daihang Liu Deguang Yang Zhangming Zhu |
| author_sort | Yang Wang |
| collection | DOAJ |
| description | Abstract Thermal and power integrity management remains a fundamental challenge in 2.5-dimensional (2.5D) integrated microsystem design. This paper proposes an electrothermal co-optimization design methodology for a 2.5D power distribution network with thermal through silicon via (TTSV) cooling. A hybrid metaheuristic optimization algorithm is presented to optimize the multi-objective function in terms of both the electrothermal properties and manufacturing cost. The proposed approach achieves an optimal solution (minimum fitness value = 310.3) for TTSV scaling and chiplet placement, albeit with increased computational complexity. Compared to the finite element simulation results, the average absolute errors of the impedance and temperature values obtained from the optimization are 3.97 $$\%$$ and 0.35 $$\%$$ , respectively. The proposed method is effective in enhancing thermal management, satisfying power and signal integrity requirements, and minimizing manufacturing costs. |
| format | Article |
| id | doaj-art-d00e0b78cccd4ff0a5c15de47dac1383 |
| institution | Kabale University |
| issn | 2045-2322 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Scientific Reports |
| spelling | doaj-art-d00e0b78cccd4ff0a5c15de47dac13832025-08-20T03:42:45ZengNature PortfolioScientific Reports2045-23222025-07-0115111610.1038/s41598-025-09914-yElectrothermal co-optimization of 2.5D power distribution network with TTSV coolingYang Wang0Changle Zhi1Gang Dong2Daihang Liu3Deguang Yang4Zhangming Zhu5School of Integrated Circuits, Xidian UniversitySchool of Integrated Circuits, Xidian UniversitySchool of Integrated Circuits, Xidian UniversitySchool of Integrated Circuits, Xidian UniversitySchool of Integrated Circuits, Xidian UniversitySchool of Integrated Circuits, Xidian UniversityAbstract Thermal and power integrity management remains a fundamental challenge in 2.5-dimensional (2.5D) integrated microsystem design. This paper proposes an electrothermal co-optimization design methodology for a 2.5D power distribution network with thermal through silicon via (TTSV) cooling. A hybrid metaheuristic optimization algorithm is presented to optimize the multi-objective function in terms of both the electrothermal properties and manufacturing cost. The proposed approach achieves an optimal solution (minimum fitness value = 310.3) for TTSV scaling and chiplet placement, albeit with increased computational complexity. Compared to the finite element simulation results, the average absolute errors of the impedance and temperature values obtained from the optimization are 3.97 $$\%$$ and 0.35 $$\%$$ , respectively. The proposed method is effective in enhancing thermal management, satisfying power and signal integrity requirements, and minimizing manufacturing costs.https://doi.org/10.1038/s41598-025-09914-yElectrothermal co-optimizationPDNTTSVHMO |
| spellingShingle | Yang Wang Changle Zhi Gang Dong Daihang Liu Deguang Yang Zhangming Zhu Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling Scientific Reports Electrothermal co-optimization PDN TTSV HMO |
| title | Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling |
| title_full | Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling |
| title_fullStr | Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling |
| title_full_unstemmed | Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling |
| title_short | Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling |
| title_sort | electrothermal co optimization of 2 5d power distribution network with ttsv cooling |
| topic | Electrothermal co-optimization PDN TTSV HMO |
| url | https://doi.org/10.1038/s41598-025-09914-y |
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