Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling
Abstract Thermal and power integrity management remains a fundamental challenge in 2.5-dimensional (2.5D) integrated microsystem design. This paper proposes an electrothermal co-optimization design methodology for a 2.5D power distribution network with thermal through silicon via (TTSV) cooling. A h...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-07-01
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| Series: | Scientific Reports |
| Subjects: | |
| Online Access: | https://doi.org/10.1038/s41598-025-09914-y |
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