A Review of Wafer-Level Packaging Technology for SAW and BAW Filters
This paper presents a comprehensive review of advancements in wafer-level packaging (WLP) technology, with a particular focus on its application in surface acoustic wave (SAW) and bulk acoustic wave (BAW) filters. As wireless communication systems continue to evolve, there is an increasing demand fo...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-03-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/3/320 |
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