A Comparative Analysis of Laser-Ablated Surface Characteristics Between the Si Face and C Face of Silicon Carbide Substrates
Silicon carbide (SiC) has significant potential as a third-generation semiconductor material due to its exceptional thermal and electronic properties, yet its high hardness and brittleness make processing costly and complex. This study introduces ultraviolet laser ablation as a method for direct SiC...
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Main Authors: | , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2025-01-01
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Series: | Micromachines |
Subjects: | |
Online Access: | https://www.mdpi.com/2072-666X/16/1/62 |
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