20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates

20 kHz X-ray diffraction on Cu thin films explores thermomechanical fatigue at high strain-rates

Modern power devices face harsh conditions in automotive applications due to high current densities during overload pulses, leading to temperature spikes of up to 300°C at ultra-fast heating rates of up to 106 K/s. This study investigated thermal stresses in 20 µm thick Cu films on Si(100) substrate...

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Bibliographic Details
Main Authors: T. Ziegelwanger, M. Reisinger, B. Vedad, K. Hlushko, S. Van Petegem, J. Todt, M. Meindlhumer, J. Keckes
Format: Article
Language:English
Published: Elsevier 2025-03-01
Series:Materials & Design
Subjects:
Synchrotron X-ray Diffraction
Thermomechanical Fatigue
High Strain-Rate
Residual Stresses
Cu Thin Film
Microelectronics
Online Access:http://www.sciencedirect.com/science/article/pii/S026412752500084X
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