Transient Thermal Cooling of Electronics Systems using Functional Graded Fins: Hybrid Computational Analysis
Passive cooling of electronics systems requires the use of fins and spines. Improved heat transfer enhancements in the systems have been achieved through porosity, magnetic field, functionally graded materials, etc. However, the space and time-dependent analysis of passive device with inherent non...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universidade Federal de Viçosa (UFV)
2023-05-01
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| Series: | The Journal of Engineering and Exact Sciences |
| Subjects: | |
| Online Access: | https://periodicos.ufv.br/jcec/article/view/15810 |
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