Transient Thermal Cooling of Electronics Systems using Functional Graded Fins: Hybrid Computational Analysis

Transient Thermal Cooling of Electronics Systems using Functional Graded Fins: Hybrid Computational Analysis

Passive cooling of electronics systems requires the use of fins and spines. Improved heat transfer enhancements in the systems have been achieved through porosity, magnetic field,  functionally graded materials, etc. However, the space and time-dependent analysis of passive device with inherent non...

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Bibliographic Details
Main Authors: Akinwale Emmanuel Jemiseye, Gbeminiyi Musibau Sobamowo, Olayiwola Olatunji Mayowa
Format: Article
Language:English
Published: Universidade Federal de Viçosa (UFV) 2023-05-01
Series:The Journal of Engineering and Exact Sciences
Subjects:
Electronic cooling; Thermal-management; Convective-radiative fin; Functionally graded materials (FGMs); Fin tip temperature; Laplace Transform-Legendre Wavelet Collocation Method (.LT-LWCM).
Online Access:https://periodicos.ufv.br/jcec/article/view/15810
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