On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions
Although several studies have examined whisker growth on Sn/Cu plating, research on whisker growth laws remain limited, particularly regarding the collective growth characteristics of multiple whiskers on plated surfaces. In this study, tin-plated copper (Sn/Cu) samples were prepared and used to obs...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425011871 |
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