On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions
Although several studies have examined whisker growth on Sn/Cu plating, research on whisker growth laws remain limited, particularly regarding the collective growth characteristics of multiple whiskers on plated surfaces. In this study, tin-plated copper (Sn/Cu) samples were prepared and used to obs...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425011871 |
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| author | Y. Sakamoto S. Ishihara K. Masuda W. Yamazaki M. Shimura |
| author_facet | Y. Sakamoto S. Ishihara K. Masuda W. Yamazaki M. Shimura |
| author_sort | Y. Sakamoto |
| collection | DOAJ |
| description | Although several studies have examined whisker growth on Sn/Cu plating, research on whisker growth laws remain limited, particularly regarding the collective growth characteristics of multiple whiskers on plated surfaces. In this study, tin-plated copper (Sn/Cu) samples were prepared and used to observe the generation and growth characteristics of numerous whiskers, which are known to grow on Sn-plated surfaces over a long time (380 days). Moreover, the statistical distribution of the lengths of multiple whiskers occurring on the sample surfaces over a certain period (hereafter referred to as whisker length distribution) was focused on. The whisker length distribution was approximated using a three-parameter Weibull distribution. The whisker growth rate (dlw/dt) could be quantitatively evaluated by focusing on the change in the whisker length distribution over time. The growth behavior of the longest whiskers, which pose the highest risk, was assessed by examining lw at F(lw) = 99.9 %, while the growth of whiskers with average length was characterized using lw at F(α) = 63.2 %. Based on the experimental observations and chemical reaction kinetics, a whisker growth law and a growth rate equation were defined. Good agreement was observed between the whisker growth law and the experimental results. |
| format | Article |
| id | doaj-art-c7ad077c176d47878b7fed5dd7d4c1b0 |
| institution | DOAJ |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-c7ad077c176d47878b7fed5dd7d4c1b02025-08-20T03:09:37ZengElsevierJournal of Materials Research and Technology2238-78542025-05-01367755776510.1016/j.jmrt.2025.05.033On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributionsY. Sakamoto0S. Ishihara1K. Masuda2W. Yamazaki3M. Shimura4National Institute of Technology, Toyama College, Hongo, Toyama, 939-8630, JapanNational Institute of Technology, Toyama College, Hongo, Toyama, 939-8630, Japan; Department of Mechanical Engineering, University of Toyama, Gofuku 3190, Toyama, 930-8555, JapanDepartment of Mechanical Engineering, University of Toyama, Gofuku 3190, Toyama, 930-8555, Japan; Corresponding author.Finecs Co. LTD., 415 Funahashi, Funahashi-mura, Nakaniikawa-gun, Toyama, 930-0281, JapanFinecs Co. LTD., 415 Funahashi, Funahashi-mura, Nakaniikawa-gun, Toyama, 930-0281, JapanAlthough several studies have examined whisker growth on Sn/Cu plating, research on whisker growth laws remain limited, particularly regarding the collective growth characteristics of multiple whiskers on plated surfaces. In this study, tin-plated copper (Sn/Cu) samples were prepared and used to observe the generation and growth characteristics of numerous whiskers, which are known to grow on Sn-plated surfaces over a long time (380 days). Moreover, the statistical distribution of the lengths of multiple whiskers occurring on the sample surfaces over a certain period (hereafter referred to as whisker length distribution) was focused on. The whisker length distribution was approximated using a three-parameter Weibull distribution. The whisker growth rate (dlw/dt) could be quantitatively evaluated by focusing on the change in the whisker length distribution over time. The growth behavior of the longest whiskers, which pose the highest risk, was assessed by examining lw at F(lw) = 99.9 %, while the growth of whiskers with average length was characterized using lw at F(α) = 63.2 %. Based on the experimental observations and chemical reaction kinetics, a whisker growth law and a growth rate equation were defined. Good agreement was observed between the whisker growth law and the experimental results.http://www.sciencedirect.com/science/article/pii/S2238785425011871Multiple whiskersWhisker growth lawSn/Cu platingWhisker length distributionWeibull distribution |
| spellingShingle | Y. Sakamoto S. Ishihara K. Masuda W. Yamazaki M. Shimura On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions Journal of Materials Research and Technology Multiple whiskers Whisker growth law Sn/Cu plating Whisker length distribution Weibull distribution |
| title | On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions |
| title_full | On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions |
| title_fullStr | On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions |
| title_full_unstemmed | On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions |
| title_short | On the growth behavior of multiple whiskers generated on Sn/Cu plating −Predicting the growth behavior of the longest whiskers using whisker length distributions |
| title_sort | on the growth behavior of multiple whiskers generated on sn cu plating predicting the growth behavior of the longest whiskers using whisker length distributions |
| topic | Multiple whiskers Whisker growth law Sn/Cu plating Whisker length distribution Weibull distribution |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425011871 |
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