Study on Calculation Method of Transient Temperature of IGBT in Metro Vehicles

The physical structure of IGBT module package was introduced, and the main mechanism of chip failure caused by heat shock was analyzed. The main transfer path of chip heat loss was analyzed, the transient heat-transfer model of each link of heat transfer was established, and the calculation method o...

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Bibliographic Details
Main Authors: Wenjie ZENG, Hua LI, Guanqiang HE, Shengpan MA, Weiwei WAN, Kai HE
Format: Article
Language:zho
Published: Editorial Department of Electric Drive for Locomotives 2021-11-01
Series:机车电传动
Subjects:
Online Access:http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.06.020
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