Grain-boundary diffusion in Cu and Ni films with thin metal coating
Investigation results of the grain-boundary diffusion in Сu films with thin Ni coating and in Ni films with thin Cu coating by the low-temperature resistometric method are presented in this work. It is shown that during the coating deposition and thermal annealing the irreversible increase in the el...
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| Format: | Article |
| Language: | English |
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Sumy State University
2009-01-01
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| Series: | Журнал нано- та електронної фізики |
| Subjects: | |
| Online Access: | http://jnep.sumdu.edu.ua/download/numbers/2009/4/articles/en/jnep_eng_2009_V1_N4_90-100.pdf |
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| _version_ | 1850241657398624256 |
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| author | T.P. Hovorun S.I. Protsenko V.A. Pchelintsev A.M. Chornous |
| author_facet | T.P. Hovorun S.I. Protsenko V.A. Pchelintsev A.M. Chornous |
| author_sort | T.P. Hovorun |
| collection | DOAJ |
| description | Investigation results of the grain-boundary diffusion in Сu films with thin Ni coating and in Ni films with thin Cu coating by the low-temperature resistometric method are presented in this work. It is shown that during the coating deposition and thermal annealing the irreversible increase in the electrical resistance by the value from tenth parts to a few Ohms is observed. This is caused by the diffusion processes of coating atoms on the grain boundaries of base layers. |
| format | Article |
| id | doaj-art-bf3dc5b330034980aed1d3051f6c5dbe |
| institution | OA Journals |
| issn | 2077-6772 |
| language | English |
| publishDate | 2009-01-01 |
| publisher | Sumy State University |
| record_format | Article |
| series | Журнал нано- та електронної фізики |
| spelling | doaj-art-bf3dc5b330034980aed1d3051f6c5dbe2025-08-20T02:00:33ZengSumy State UniversityЖурнал нано- та електронної фізики2077-67722009-01-011490100Grain-boundary diffusion in Cu and Ni films with thin metal coatingT.P. HovorunS.I. ProtsenkoV.A. PchelintsevA.M. ChornousInvestigation results of the grain-boundary diffusion in Сu films with thin Ni coating and in Ni films with thin Cu coating by the low-temperature resistometric method are presented in this work. It is shown that during the coating deposition and thermal annealing the irreversible increase in the electrical resistance by the value from tenth parts to a few Ohms is observed. This is caused by the diffusion processes of coating atoms on the grain boundaries of base layers.http://jnep.sumdu.edu.ua/download/numbers/2009/4/articles/en/jnep_eng_2009_V1_N4_90-100.pdfGrain-Boundary DiffusionDiffusion ProcessesGrain BoundaryThin CoatingAverage Grain Size |
| spellingShingle | T.P. Hovorun S.I. Protsenko V.A. Pchelintsev A.M. Chornous Grain-boundary diffusion in Cu and Ni films with thin metal coating Журнал нано- та електронної фізики Grain-Boundary Diffusion Diffusion Processes Grain Boundary Thin Coating Average Grain Size |
| title | Grain-boundary diffusion in Cu and Ni films with thin metal coating |
| title_full | Grain-boundary diffusion in Cu and Ni films with thin metal coating |
| title_fullStr | Grain-boundary diffusion in Cu and Ni films with thin metal coating |
| title_full_unstemmed | Grain-boundary diffusion in Cu and Ni films with thin metal coating |
| title_short | Grain-boundary diffusion in Cu and Ni films with thin metal coating |
| title_sort | grain boundary diffusion in cu and ni films with thin metal coating |
| topic | Grain-Boundary Diffusion Diffusion Processes Grain Boundary Thin Coating Average Grain Size |
| url | http://jnep.sumdu.edu.ua/download/numbers/2009/4/articles/en/jnep_eng_2009_V1_N4_90-100.pdf |
| work_keys_str_mv | AT tphovorun grainboundarydiffusionincuandnifilmswiththinmetalcoating AT siprotsenko grainboundarydiffusionincuandnifilmswiththinmetalcoating AT vapchelintsev grainboundarydiffusionincuandnifilmswiththinmetalcoating AT amchornous grainboundarydiffusionincuandnifilmswiththinmetalcoating |