Grain-boundary diffusion in Cu and Ni films with thin metal coating
Investigation results of the grain-boundary diffusion in Сu films with thin Ni coating and in Ni films with thin Cu coating by the low-temperature resistometric method are presented in this work. It is shown that during the coating deposition and thermal annealing the irreversible increase in the el...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Sumy State University
2009-01-01
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| Series: | Журнал нано- та електронної фізики |
| Subjects: | |
| Online Access: | http://jnep.sumdu.edu.ua/download/numbers/2009/4/articles/en/jnep_eng_2009_V1_N4_90-100.pdf |
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