Glass Microbubble Encapsulation for Improving the Lifetime of a Ferrofluid-Based Magnetometer

In this paper, we explore the use of chip-scale blown glass microbubble structures for MEMS packaging applications. Specifically, we demonstrate the efficacy of this method of packaging for the improvement of the lifetime of a ferrofluid-based magnetoviscous magnetometer. We have previously reported...

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Bibliographic Details
Main Authors: Chenchen Zhang, Srinivas Tadigadapa
Format: Article
Language:English
Published: MDPI AG 2025-04-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/16/5/519
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