Glass Microbubble Encapsulation for Improving the Lifetime of a Ferrofluid-Based Magnetometer
In this paper, we explore the use of chip-scale blown glass microbubble structures for MEMS packaging applications. Specifically, we demonstrate the efficacy of this method of packaging for the improvement of the lifetime of a ferrofluid-based magnetoviscous magnetometer. We have previously reported...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/5/519 |
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