Hybrid Photonic Integrated Circuits for Wireless Transceivers

Hybrid Photonic Integrated Circuits for Wireless Transceivers

Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer HHI. This work leverages hybrid integration technology, which combines indium phosphide (InP) active elements, silicon nitride (Si<sub>...

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Main Authors: Tianwen Qian, Ben Schuler, Y. Durvasa Gupta, Milan Deumer, Efstathios Andrianopoulos, Nikolaos K. Lyras, Martin Kresse, Madeleine Weigel, Jakob Reck, Klara Mihov, Philipp Winklhofer, Csongor Keuer, Laurids von Emden, Marcel Amberg, Crispin Zawadzki, Moritz Kleinert, Simon Nellen, Davide de Felipe, Hercules Avramopoulos, Robert B. Kohlhaas, Norbert Keil, Martin Schell
Format: Article
Language:English
Published: MDPI AG 2025-04-01
Series:Photonics
Subjects:
hybrid integration
wireless transceivers
high-speed wireless communication
photonic integrated circuits
Online Access:https://www.mdpi.com/2304-6732/12/4/371
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