Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators
The cure kinetics and mechanisms of a biphenyl type epoxy molding compounds (EMCs) with thermal latency organophosphine accelerators were studied using differential scanning calorimetry (DSC). Although the use of triphenylphosphine-1,4-benzoquinone (TPP-BQ) and triphenylphosphine (TPP) catalysts in...
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Wiley
2013-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2013/391267 |
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| author | Chean-Cheng Su Chien-Huan Wei Bo-Ching Li |
| author_facet | Chean-Cheng Su Chien-Huan Wei Bo-Ching Li |
| author_sort | Chean-Cheng Su |
| collection | DOAJ |
| description | The cure kinetics and mechanisms of a biphenyl type epoxy molding compounds (EMCs) with thermal latency organophosphine accelerators were studied using differential scanning calorimetry (DSC). Although the use of triphenylphosphine-1,4-benzoquinone (TPP-BQ) and triphenylphosphine (TPP) catalysts in biphenyl type EMCs exhibited autocatalytic mechanisms, thermal latency was higher in the TPP-BQ catalyst in EMCs than in the TPP catalyst in EMCs. Analyses of thermal characteristics indicated that TPP-BQ is inactive at low temperatures. At high temperatures, however, TPP-BQ increases the curing rate of EMC in dynamic and isothermal curing experiments. The reaction of EMCs with the TPP-BQ latent catalyst also had a higher temperature sensitivity compared to the reaction of EMCs with TPP catalyst. In resin transfer molding, EMCs containing the TPP-BQ thermal latency accelerator are least active at a low temperature. Consequently, EMCs have a low melt viscosity before gelation, and the resins and filler are evenly mixed in the kneading process. Additionally, flowability is increased before the EMCs form a network structure in the molding process. The proposed kinetic model adequately describes curing behavior in EMCs cured with two different organophosphine catalysts up to the rubber state in the progress of curing. |
| format | Article |
| id | doaj-art-bd81bbc2339b47b9bc869ed4fec64dba |
| institution | DOAJ |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2013-01-01 |
| publisher | Wiley |
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| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-bd81bbc2339b47b9bc869ed4fec64dba2025-08-20T03:23:34ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422013-01-01201310.1155/2013/391267391267Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency AcceleratorsChean-Cheng Su0Chien-Huan Wei1Bo-Ching Li2Department of Chemical and Materials Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung 811, TaiwanDepartment of Chemical and Materials Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung 811, TaiwanDepartment of Chemical and Materials Engineering, National University of Kaohsiung, No. 700, Kaohsiung University Road, Nan-Tzu District, Kaohsiung 811, TaiwanThe cure kinetics and mechanisms of a biphenyl type epoxy molding compounds (EMCs) with thermal latency organophosphine accelerators were studied using differential scanning calorimetry (DSC). Although the use of triphenylphosphine-1,4-benzoquinone (TPP-BQ) and triphenylphosphine (TPP) catalysts in biphenyl type EMCs exhibited autocatalytic mechanisms, thermal latency was higher in the TPP-BQ catalyst in EMCs than in the TPP catalyst in EMCs. Analyses of thermal characteristics indicated that TPP-BQ is inactive at low temperatures. At high temperatures, however, TPP-BQ increases the curing rate of EMC in dynamic and isothermal curing experiments. The reaction of EMCs with the TPP-BQ latent catalyst also had a higher temperature sensitivity compared to the reaction of EMCs with TPP catalyst. In resin transfer molding, EMCs containing the TPP-BQ thermal latency accelerator are least active at a low temperature. Consequently, EMCs have a low melt viscosity before gelation, and the resins and filler are evenly mixed in the kneading process. Additionally, flowability is increased before the EMCs form a network structure in the molding process. The proposed kinetic model adequately describes curing behavior in EMCs cured with two different organophosphine catalysts up to the rubber state in the progress of curing.http://dx.doi.org/10.1155/2013/391267 |
| spellingShingle | Chean-Cheng Su Chien-Huan Wei Bo-Ching Li Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators Advances in Materials Science and Engineering |
| title | Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators |
| title_full | Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators |
| title_fullStr | Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators |
| title_full_unstemmed | Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators |
| title_short | Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators |
| title_sort | thermal and cure kinetics of epoxy molding compounds cured with thermal latency accelerators |
| url | http://dx.doi.org/10.1155/2013/391267 |
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