Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators
The cure kinetics and mechanisms of a biphenyl type epoxy molding compounds (EMCs) with thermal latency organophosphine accelerators were studied using differential scanning calorimetry (DSC). Although the use of triphenylphosphine-1,4-benzoquinone (TPP-BQ) and triphenylphosphine (TPP) catalysts in...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2013-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2013/391267 |
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