Su, C., Wei, C., & Li, B. Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators. Wiley.
Chicago Style (17th ed.) CitationSu, Chean-Cheng, Chien-Huan Wei, and Bo-Ching Li. Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators. Wiley.
MLA (9th ed.) CitationSu, Chean-Cheng, et al. Thermal and Cure Kinetics of Epoxy Molding Compounds Cured with Thermal Latency Accelerators. Wiley.
Warning: These citations may not always be 100% accurate.