Review on atomistic and quantum mechanical simulation approaches in chemical mechanical planarization

Review on atomistic and quantum mechanical simulation approaches in chemical mechanical planarization

Chemical mechanical planarization (CMP) faces critical challenges including non-uniform material removal, surface defect generation, and complex tribochemical interactions that limit process control at advanced semiconductor nodes. This review examines computational simulation approaches that addres...

Full description

Saved in:
Bibliographic Details
Main Authors: Seokgyu Ryu, Murali Ramu, Patrick Joohyun Kim, Junghyun Choi, Kangchun Lee, Jihoon Seo
Format: Article
Language:English
Published: Elsevier 2025-09-01
Series:Applied Surface Science Advances
Subjects:
Chemical mechanical planarization
Computational simulation
Density functional theory
Molecular dynamics
Fukui function
Online Access:http://www.sciencedirect.com/science/article/pii/S2666523925001278
Tags: Add Tag
No Tags, Be the first to tag this record!

Internet

http://www.sciencedirect.com/science/article/pii/S2666523925001278

Similar Items