Selecting the Trajectory of the Laser Beam to Form Vias in the Silicon Substrate

Selecting the Trajectory of the Laser Beam to Form Vias in the Silicon Substrate

One of the promising technological directions for the implementation of multi-crystal modules is the assembly of 3D modules. The peculiarity of this technology is the arrangement of the assembly components not only in the horizontal plane, but also vertically. The formation of contact connections be...

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Bibliographic Details
Main Author: A. I. Lapo
Format: Article
Language:Russian
Published: Educational institution «Belarusian State University of Informatics and Radioelectronics» 2024-12-01
Series:Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki
Subjects:
modeling
trajectory
heating
laser beam
thermal fields
via
silicon wafer
3d module
Online Access:https://doklady.bsuir.by/jour/article/view/4021
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