Selecting the Trajectory of the Laser Beam to Form Vias in the Silicon Substrate
One of the promising technological directions for the implementation of multi-crystal modules is the assembly of 3D modules. The peculiarity of this technology is the arrangement of the assembly components not only in the horizontal plane, but also vertically. The formation of contact connections be...
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| Format: | Article |
| Language: | Russian |
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Educational institution «Belarusian State University of Informatics and Radioelectronics»
2024-12-01
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| Series: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Subjects: | |
| Online Access: | https://doklady.bsuir.by/jour/article/view/4021 |
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