Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy
This research work is focused on studying the effect of indium (In) and silver (Ag) addition on the thermo-mechanical properties of lead-free Sn-Bi solder alloy. Sn-30B is a potential solder to be used as thermal interface material; however, its enhanced thermo-mechanical properties are yet to be ex...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-06-01
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| Series: | Journal of Alloys and Metallurgical Systems |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2949917825000355 |
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| _version_ | 1849694556005597184 |
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| author | Munim Shahriar Jawad Md. Asif Mahmud Noman Ridwan Radit Ahsan Md. Muktadir Billah |
| author_facet | Munim Shahriar Jawad Md. Asif Mahmud Noman Ridwan Radit Ahsan Md. Muktadir Billah |
| author_sort | Munim Shahriar Jawad |
| collection | DOAJ |
| description | This research work is focused on studying the effect of indium (In) and silver (Ag) addition on the thermo-mechanical properties of lead-free Sn-Bi solder alloy. Sn-30B is a potential solder to be used as thermal interface material; however, its enhanced thermo-mechanical properties are yet to be explored. In this study, authors therefore investigated the effect of In-3Ag alloy addition to tailoring the thermo-mechanical properties of the Sn-30Bi solder alloy. The microstructural evolution with progressive alloying was studied using both optical and field emission scanning electron microscopy (FESEM). Elemental analysis to confirm the alloying was done using the energy dispersive spectroscopy (EDS). Simultaneous thermogravimetry-differential scanning calorimetry (STA/TG-DSC) was used to study the thermal behavior of all the solder alloys. To assess the mechanical properties, microhardness and tensile properties were also measured. Finally, the effect of low-temperature ageing was also studied to evaluate the performance of the newly developed solder alloy as thermal interface material at the operating temperature. From these results, it was found that the Sn-30Bi-3(In-3Ag) alloy has superior properties among all the solder alloys. |
| format | Article |
| id | doaj-art-ba0b233dbb0a41edaf9d801aabf8c7e3 |
| institution | DOAJ |
| issn | 2949-9178 |
| language | English |
| publishDate | 2025-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Alloys and Metallurgical Systems |
| spelling | doaj-art-ba0b233dbb0a41edaf9d801aabf8c7e32025-08-20T03:20:01ZengElsevierJournal of Alloys and Metallurgical Systems2949-91782025-06-011010018510.1016/j.jalmes.2025.100185Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloyMunim Shahriar Jawad0Md. Asif Mahmud Noman1Ridwan Radit Ahsan2Md. Muktadir Billah3Department of Materials and Metallurgical Engineering (MME), Bangladesh University of Engineering and Technology (BUET), Dhaka 1000, BangladeshDepartment of Materials and Metallurgical Engineering (MME), Bangladesh University of Engineering and Technology (BUET), Dhaka 1000, BangladeshDepartment of Materials and Metallurgical Engineering (MME), Bangladesh University of Engineering and Technology (BUET), Dhaka 1000, BangladeshCorresponding author.; Department of Materials and Metallurgical Engineering (MME), Bangladesh University of Engineering and Technology (BUET), Dhaka 1000, BangladeshThis research work is focused on studying the effect of indium (In) and silver (Ag) addition on the thermo-mechanical properties of lead-free Sn-Bi solder alloy. Sn-30B is a potential solder to be used as thermal interface material; however, its enhanced thermo-mechanical properties are yet to be explored. In this study, authors therefore investigated the effect of In-3Ag alloy addition to tailoring the thermo-mechanical properties of the Sn-30Bi solder alloy. The microstructural evolution with progressive alloying was studied using both optical and field emission scanning electron microscopy (FESEM). Elemental analysis to confirm the alloying was done using the energy dispersive spectroscopy (EDS). Simultaneous thermogravimetry-differential scanning calorimetry (STA/TG-DSC) was used to study the thermal behavior of all the solder alloys. To assess the mechanical properties, microhardness and tensile properties were also measured. Finally, the effect of low-temperature ageing was also studied to evaluate the performance of the newly developed solder alloy as thermal interface material at the operating temperature. From these results, it was found that the Sn-30Bi-3(In-3Ag) alloy has superior properties among all the solder alloys.http://www.sciencedirect.com/science/article/pii/S2949917825000355TIMTernary eutecticSolidification rangeGrain refinementLow-temperature ageing |
| spellingShingle | Munim Shahriar Jawad Md. Asif Mahmud Noman Ridwan Radit Ahsan Md. Muktadir Billah Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy Journal of Alloys and Metallurgical Systems TIM Ternary eutectic Solidification range Grain refinement Low-temperature ageing |
| title | Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy |
| title_full | Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy |
| title_fullStr | Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy |
| title_full_unstemmed | Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy |
| title_short | Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy |
| title_sort | modulating thermo mechanical properties of lead free sn 30bi tim by adding in 3ag alloy |
| topic | TIM Ternary eutectic Solidification range Grain refinement Low-temperature ageing |
| url | http://www.sciencedirect.com/science/article/pii/S2949917825000355 |
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