Modulating thermo-mechanical properties of lead-free Sn-30Bi TIM by adding In-3Ag alloy
This research work is focused on studying the effect of indium (In) and silver (Ag) addition on the thermo-mechanical properties of lead-free Sn-Bi solder alloy. Sn-30B is a potential solder to be used as thermal interface material; however, its enhanced thermo-mechanical properties are yet to be ex...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-06-01
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| Series: | Journal of Alloys and Metallurgical Systems |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2949917825000355 |
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