Evaluation of Copper Diffusion Bonding Parameters Applied to the Manufacture of Flat Heat Pipes

Evaluation of Copper Diffusion Bonding Parameters Applied to the Manufacture of Flat Heat Pipes

Flat heat pipes are highly effective for electronic thermal management, combining compact design with efficient heat transfer. Diffusion bonding is a promising manufacturing method, enabling leak-tight joints without notable plastic deformation. This study examined the effects of bonding temperature...

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Bibliographic Details
Main Authors: Larissa Perego Mendes, Maria Cristina Amaral, Lucas de Andrade Caldas, Bianca Müller Martins, Kelvin Guessi Domiciano, Larissa Krambeck, Fabio Antonio Xavier, Marcia Barbosa Henriques Mantelli
Format: Article
Language:English
Published: Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol) 2025-06-01
Series:Materials Research
Subjects:
Diffusion welding
Heat pipes
Copper
Electronics
Bonding processes
Online Access:http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392025000200224&lng=en&tlng=en
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