Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition
Highlights With plasma immersion deposition technology, multilayer copper–carbon nanofilms were fabricated and conductivity can achieve up to 30.20% increase compared to pure copper. By applying effective medium theory, first-principles calculations, and density of states analysis, the critical role...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
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SpringerOpen
2025-02-01
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| Series: | Nano-Micro Letters |
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| Online Access: | https://doi.org/10.1007/s40820-024-01628-6 |
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| _version_ | 1823861670105055232 |
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| author | Haotian Weng Xiwu Zhang Xuan Liu Yunhui Tang Hewei Yuan Yang Xu Kun Li Xiaolu Huang |
| author_facet | Haotian Weng Xiwu Zhang Xuan Liu Yunhui Tang Hewei Yuan Yang Xu Kun Li Xiaolu Huang |
| author_sort | Haotian Weng |
| collection | DOAJ |
| description | Highlights With plasma immersion deposition technology, multilayer copper–carbon nanofilms were fabricated and conductivity can achieve up to 30.20% increase compared to pure copper. By applying effective medium theory, first-principles calculations, and density of states analysis, the critical roles of copper atom adsorption sites and electron migration pathways within the nanocarbon film were analyzed, elucidating the mechanism of the conductivity enhancement. Large-scale electrode coating equipment suitable for industrial production was developed. |
| format | Article |
| id | doaj-art-b5f11c7a8a664a6fa6698f14558a292b |
| institution | Kabale University |
| issn | 2311-6706 2150-5551 |
| language | English |
| publishDate | 2025-02-01 |
| publisher | SpringerOpen |
| record_format | Article |
| series | Nano-Micro Letters |
| spelling | doaj-art-b5f11c7a8a664a6fa6698f14558a292b2025-02-09T12:50:57ZengSpringerOpenNano-Micro Letters2311-67062150-55512025-02-0117111610.1007/s40820-024-01628-6Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion DepositionHaotian Weng0Xiwu Zhang1Xuan Liu2Yunhui Tang3Hewei Yuan4Yang Xu5Kun Li6Xiaolu Huang7Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong UniversityJinduo Yuchen Water Environment Engineering Co., LtdDepartment of Mechanical Engineering College of Engineering, Shanghai Ocean UniversityFaculty of Materials and Manufacturing, Beijing University of TechnologyKey Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong UniversityKey Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong UniversityKey Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong UniversityKey Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong UniversityHighlights With plasma immersion deposition technology, multilayer copper–carbon nanofilms were fabricated and conductivity can achieve up to 30.20% increase compared to pure copper. By applying effective medium theory, first-principles calculations, and density of states analysis, the critical roles of copper atom adsorption sites and electron migration pathways within the nanocarbon film were analyzed, elucidating the mechanism of the conductivity enhancement. Large-scale electrode coating equipment suitable for industrial production was developed.https://doi.org/10.1007/s40820-024-01628-6Copper–carbon nanofilmsPlasma immersionCarbon layer depositionElectron mobility |
| spellingShingle | Haotian Weng Xiwu Zhang Xuan Liu Yunhui Tang Hewei Yuan Yang Xu Kun Li Xiaolu Huang Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition Nano-Micro Letters Copper–carbon nanofilms Plasma immersion Carbon layer deposition Electron mobility |
| title | Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition |
| title_full | Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition |
| title_fullStr | Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition |
| title_full_unstemmed | Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition |
| title_short | Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition |
| title_sort | enhanced conductivity of multilayer copper carbon nanofilms via plasma immersion deposition |
| topic | Copper–carbon nanofilms Plasma immersion Carbon layer deposition Electron mobility |
| url | https://doi.org/10.1007/s40820-024-01628-6 |
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