Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition

Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition

Highlights With plasma immersion deposition technology, multilayer copper–carbon nanofilms were fabricated and conductivity can achieve up to 30.20% increase compared to pure copper. By applying effective medium theory, first-principles calculations, and density of states analysis, the critical role...

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Bibliographic Details
Main Authors: Haotian Weng, Xiwu Zhang, Xuan Liu, Yunhui Tang, Hewei Yuan, Yang Xu, Kun Li, Xiaolu Huang
Format: Article
Language:English
Published: SpringerOpen 2025-02-01
Series:Nano-Micro Letters
Subjects:
Copper–carbon nanofilms
Plasma immersion
Carbon layer deposition
Electron mobility
Online Access:https://doi.org/10.1007/s40820-024-01628-6
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https://doi.org/10.1007/s40820-024-01628-6

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