Interfacial delamination on fan-out wafer-level package using finite element analysis
Fan-out wafer-level packaging has become a widely known approach for achieving a microelectronic device with low cost, smaller package size, and good electrical performance. Large temperature variations occur during these fabrication processes which can induce internal stresses and interfacial delam...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-06-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025007054 |
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