Study on a Simulation Method for IGBT Bonded Wire Cracking Under Power Cycling Conditions Considering the Effect of Damage Evolution
For high-power modules with wire bonding as the interconnection method, fatigue damage and cracking at the bond interface are important forms of module failure. However, the currently used numerical models of the bond interface neglect the influence of microdefects and damage evolution of the interf...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10806676/ |
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