Review of Electronic Cooling and Thermal Management in Space and Aerospace Applications
The continuous miniaturization of electronics, high processing capacity, compact microelectronic devices, and high circuit density contribute to an increasing demand for the efficient cooling of electronics. For aerospace and space applications, where packaging and the optimal use of space, weight,...
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| Format: | Article |
| Language: | English |
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MDPI AG
2025-03-01
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| Series: | Engineering Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-4591/89/1/42 |
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