Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints

Power cycle reliability of solder joints with Sn-5Sb (mass%) and Sn-10Sb (mass%) alloys was investigated. The effects of power cycling and heat aging on the growth of intermetallic compound (IMC) layers at the interfaces between Sn-Sb alloys and Cu plates were also investigated. In the power cycling...

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Bibliographic Details
Main Authors: Tatsuya Kobayashi, Ikuo Shohji, Yusuke Nakata
Format: Article
Language:English
Published: Wiley 2018-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2018/4829508
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